IC Failure Analysis Lab - Diagnostic, Failure Analysis and Reliability Testing of Semiconductors IC Failure Analysis Test Diagnostics Semiconductor Circuit Board Electronics Failure Center  
IC Failure Analysis Test Diagnostics Semiconductor Circuit Board Electronics Failure Center
IC Failure Analysis Test Diagnostics Semiconductor Circuit Board Electronics Failure Center
IC Failure Analysis Test Diagnostics Semiconductor Circuit Board Electronics Failure Center
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IC Failure Analysis Test Diagnostics Semiconductor Circuit Board Electronics Failure Center

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IC Failure Analysis Test Diagnostics Semiconductor Circuit Board Electronics Failure Center
IC Failure Analysis Test Diagnostics Semiconductor Circuit Board Electronics Failure Center
 

IC Failure Analysis Lab

IC Failure Analysis Test Diagnostics Semiconductor Circuit Board Electronics Failure Center IC Failure Analysis Lab is a privately held company located in Orange County, California. IC Failure Analysis Lab Services' personnel have decades of collective experience in microanalysis and process analysis.

These experiences have enabled us to bring high quality and low cost Failure Analysis, Microsurgery, and Reliability testing services in semiconductor, electronics, aerospace, military, and computers to our customers.

Our state-of-the-art equipment and breadth of skilled workers is unmatched in America and Asia.

Our turnkey services can save up to 45% of your current FA and Reliability testing costs.



IC Failure Analysis Lab will be pleased to assist you in the following areas:

  • Counterfeit Component Authenticity
  • Decapsulation by chemical wet etch / Laser
  • Delayering / Parallel Lapping
  • EMMI (Emission Microscopy)
  • FIB (Focused Ion Beam) Precision Cutting
  • InGaAs EMMI
  • I-V (Curve Trace) measurement
  • Mechanical Polishing
  • OBIRCH (Optical Beam Induced Resistance Change)
  • OM(Optical Microscope)
  • OP(Optical Profiler)
  • SAM (Scanning Acoustic Microscopy) or SAT(Scanning Acoustic Tomography)
  • SEM (Scanning Electron Microscopy)
  • SIMS (Secondary Ion Mass Spectrometry)
  • TEM (Transmission Electron Microscope)
  • X-Ray (Standard / 2-D) Examination
  • X-Ray (3-D) Examination

Reliability Services

  • Autoclave or Pressure Cooker Test
  • Bias Life Test (BLT)
  • Die Shear Test
  • ESD - Charged Device Model (CDM)
  • ESD - Human Body Model (HBM)
  • ESD - Machine Model (MM)
  • HAST (Highly Accelerated Temperature and Humidity Stress Test)
  • High-Temperature Storage Life Test (HTSL)
  • HTOL (High Temperature Operating Life Test) / Burn-in
  • Humidity-Bias Test (THB)
  • Latch-up Test
  • Lead Integrity Test
  • Mark Permanency Test
  • Moisture/Reflow Sensitivity Classification (MSC)
  • Physical Dimension Measurement
  • Preconditioning Test (PC)
  • Real Time Thermal Profiling
  • Solderability
  • Solder Ball Shear Test (BGA)
  • Temperature Cycling (TC) Air to Air
  • Temperature Humidity Bias Lifetest 85°C/85%
  • Thermal Shock (Liquid to Liquid)
  • Wire Bond Pull Test
  • Wire Bond Shear Test
IC Failure Analysis Test Diagnostics Semiconductor Circuit Board Electronics Failure Center
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