IC Failure Analysis Lab - Services
IC Failure Analysis Lab offers a virtually unlimited service of:
When it comes to our business, we offer our customers a powerful resource and a recipe for success.
Price Guarantee: We guarantee our price to be lower than any North American lab or we will gladly beat their price by 20% of the difference.
Listed below is a short list of services we offer our clients. If you do not see your required service listed below, please contact us
To request a service, please complete our Service Request Form and email it to us.
Failure Analysis Services
- Counterfeit Component Authenticity
- Decapsulation by chemical wet etch / Laser
- Delayering / Parallel Lapping
- EMMI (Emission Microscopy)
- FIB (Focused Ion Beam) Precision Cutting
- InGaAs EMMI
- I-V (Curve Trace) measurement
- Mechanical Polishing
- OBIRCH (Optical Beam Induced Resistance Change)
- OM(Optical Microscope)
- OP(Optical Profiler)
- SAM (Scanning Acoustic Microscopy) or SAT(Scanning Acoustic Tomography)
- SEM (Scanning Electron Microscopy)
- SIMS (Secondary Ion Mass Spectrometry)
- TEM (Transmission Electron Microscope)
- X-Ray (Standard / 2-D) Examination
- X-Ray (3-D) Examination
Reliability Services
- Autoclave or Pressure Cooker Test
- Bias Life Test (BLT)
- Die Shear Test
- ESD - Charged Device Model (CDM)
- ESD - Human Body Model (HBM)
- ESD - Machine Model (MM)
- Fine and Gross Leak Testing (Seal)
- HAST (Highly Accelerated Temperature and Humidity Stress Test)
- High-Temperature Storage Life Test (HTSL)
- HTOL (High Temperature Operating Life Test) / Burn-in
- Humidity-Bias Test (THB)
- Latch-up Test
- Lead Integrity Test
- Mark Permanency Test
- Moisture/Reflow Sensitivity Classification (MSC)
- Physical Dimension Measurement
- Preconditioning Test (PC)
- Real Time Thermal Profiling
- Solderability
- Solder Ball Shear Test (BGA)
- Temperature Cycling (TC) Air to Air
- Temperature Humidity Bias Lifetest 85°C/85%
- Thermal Shock (Liquid to sqLiquid)
- Wire Bond Pull Test
- Wire Bond Shear Test
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